TSMC considers introducing advanced chip packaging production capacity in Japan


technology

Reuters exclusive report Taiwan’s TSMC is considering building advanced packaging capacity in Japan, a move that would add momentum to Japan’s efforts to restart the semiconductor industry.

market impact

Japan is considered capable of playing a larger role in advanced packaging, given its leading semiconductor materials and equipment manufacturers, growing investment in chip manufacturing capabilities and a solid customer base.

Article tags

Topics of interest: technology

type: Reuters Best

department: technology

area: Asia

nation: JapanTaiwan

Winning type: exclusivity

Story type: exclusive/exclusive report

media type: text

Customer Impact: Important regional stories



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By Ali Raza

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